Memory chip maker SK Hynix to set up memory semiconductor FAB in Korea at $1.8bn

South Korean memory chip maker SK Hynix will invest 2.2 trillion won ($1.8 billion) to set up a new memory semiconductor FAB in Chungcheongbuk-do province to cope up with the growing demand for NAND Flash demand.

The new memory semiconductor FAB, which will come up at Cheongju Technopolis site in Cheongju, is said to be part of the memory chip maker’s mid or long-term investment strategy revealed in August 2015 at the completion ceremony of M14 DRAM and NAND Foundry in Icheon.

SK Hynix, at that time, had revealed its plans of investing 46 trillion won ($40 billion) for establishing three new FABs in Icheon and Cheongju which also included the M14 DRAM and NAND Foundry.

SK Hynix NAND Flash image

SK Hynix NAND Flash (Photo courtesy : SK HYNIX INC.)

SK Hynix CEO Sung Wook Park said: “The new FAB to be constructed in Cheongju will become a part of our key production facilities to gear up for the upcoming fourth industrial revolution.

“Sincerely appreciate great assistance from the National, Chungcheongbuk-do and Cheongju government officials in the construction of the new FAB at a proper time.”

Design of the SK Hynix Cheongju memory semiconductor FAB will begin within next month, said the company which will commence construction of the shell and the cleanroom in August next year. The completion of the SK Hynix Cheongju memory semiconductor FAB project is likely to be over by June 2019.

SK Hynix also revealed that it will inject an additional investment of 950 billion won ($795 million) to expand its cleanroom space of the Wuxi DRAM FAB in Jiangsu province, China.

The South Korean memory chip maker said that it has to cover up for the potential loss of wafer capacity at the Wuxi DRAM FAB through expansion of the floor space which will be done from July 2017 to April 2019.

Headquartered in Icheon, South Korea, SK Hynix is among the leading semiconductor suppliers in the world, providing Dynamic Random Access Memory chips (“DRAM”), Flash memory chips (“NAND Flash”) and CMOS Image Sensors (“CIS”) to its worldwide located customers.

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